X.PIN· @thexpin · X·· 2 小时前AI 评分56
AI 导读
京东方年产 1000 片晶圆的玻璃基板试验线已出货尺寸超过 100×100mm 的 24 层玻璃基板，并全部通过了客户的可靠性测试。英特尔和英伟达将玻璃基板视为下一代 AI 芯片封装的解决方案，京东方正加速推进该领域应用。
正文 · 原文
Intel and Nvidia view glass substrates as the ultimate solution for next-generation AI chip packaging, but Chinese display giant BOE might beat their suppliers to market.
BOE recently revealed that its 1,000-wafer-per-month pilot line has already shipped 24-layer glass substrates measuring over 100 by 100 millimeters, all of which passed client reliability testing.
来源：X.PIN · x.com